The aim of this project is to experiment with [High Speed Transceivers (SERDES)](https://en.wikipedia.org/wiki/Multi-gigabit_transceiver) of popular FPGAs to create a [USB3.0 PIPE interface](https://www.intel.com/content/dam/www/public/us/en/documents/white-papers/phy-interface-pci-express-sata-usb30-architectures-3.1.pdf).
While we hope this wrapper will eventually support multiple protocols through the PIPE interface (such as PCIe, SATA, DisplayPort) it is currently targetting support for [USB3.0 SuperSpeed](https://en.wikipedia.org/wiki/USB_3.0#Data_encoding) when used with a customized [the Daisho USB3 core](https://github.com/enjoy-digital/daisho).
- [3-Port USB 3 FMC Module from HiTechGlobal](https://hitechglobal.us/index.php?route=product/product&path=18_81&product_id=233).
These boards have been previously shown to work with [the Daisho Core](https://github.com/enjoy-digital/daisho) and the [TI TUSB1310A - SuperSpeed 5 Gbps USB 3.0 Transceiver with PIPE and ULPI Interfaces](http://www.ti.com/product/TUSB1310A).